Foreword to the KEM Special Issue by the 2nd International Congress on Advanced Materials
Executive Chair, the 2nd International Congress on Advanced Materials
President, Chinese Advanced Materials Society
The publication of this special issue by Key Engineering Materials represents a commemoration to the 2nd International Congress on Advanced Materials hosted by Jiangsu University, Zhenjiang, China, during 16-19th May 2013 (http://am2013.ujs.edu.cn). The congress was known as the 2nd one of its kind sponsored by International Union of Advanced Materials, along with Chinese Advanced Materials Society.
As the executive chair, I am greatly delighted to help organize this conference. Ten supporting journals, including Journal of Inorganic and Organometallic Polymers and Materials (JIOPM; Springer), Monatshefte für Chemie - Chemical Monthly (CM; Springer) Journal of the Chinese Advanced Materials Society (JCAMS; Taylor Francis), Journal of Energetic Materials (JEM; Taylor & Francis), Journal of Nano Research (JNanoR; Trans Tech), Polymers & Polymer Composites (PPC; Smithers Rapra), Current Organic Chemistry (COC; Bentham Science), Key Engineering Materials (KEM; Trans Tech), The Open Electrochemistry Journal (TOEJ; Bentham Science), and American Journal of Environmental Science (AJES; Science publications), have included ca. 700 full manuscripts contributed and 315 abstracts. The host Jiangsu University has played an important role in helping run the organizing of this congress. The close cooperation between the host and other joint organizers including the University of Jinan, State Key Laboratory of Bioreactor Engineering (East China University of Science and Technology), and Hengyang Normal University have made feasible the completion of this conference.
With the participation of 600-plus researchers and scientists from across the world, the congress has demonstrated itself prestigious in the field of advanced materials. The fabrication of the scientific program has involved 600-plus participants, 700 full manuscripts and 315 abstracts from across the world. The scientific program was enriched by the welcome address from the local deputy governor, along with the conference introduction by Xiaonong Cheng (Jiangsu University, China), the opening remarks by Sergey A Piletsky (Cranfield University) and Alaa Abd-El-Aziz (University of Prince Edward Island, Canada), and two symposia.
It is also very pleasant to recall that the congress has been successful in not only scientific context but also social and cultural context. The conference site Zhenjiang is well known as the famous humanistic city in east China, which holds a 2500-year's history and has a splendid humanistic environment. The Jinshan Temple, a site originating the white-snake fairy tale, has received tourists as many as more than 400 million in the past decade. Many of tourists have left their tears behind when recalling the memory of the beautiful white-snake story. Some of them have also temporarily written their names in the inner wall of the Temple, in order to pay memorable tribute to their gods imagined and to envision a better perspective. Other prominent landscapes in Zhenjiang include Zhaoyin Temple, Jiaoshan maintain, and Lingquan spring, which act also as a window for outside to understand Chinese cultures and history. Thus, the choice of Zhenjiang as the conference site, in fact, has played some roles in leading to the eventual success of this congress.
To commemorate the 2013 congress, the executive committee has invited Professor Shiquan Liu, vice president of the Chinese Advanced Materials Society, to serve as the guest editor for the present congressional issue. I am pleased that he has enthusiastically taken on this task, resulting in publication of the excellent issue. It is satisfying that all papers published in this issue has gone through scientific reviewing and editorial scrutiny. While it has not been possible to publish a comprehensive proceedings volume based on the entire congressional scientific program, this issue does represent a memorable tribute not only to the authors, but also to those who contributed to the overall success of the congress.
Finally, with the deepest feeling, I want to express my special thanks to Key Engineering Materials for generous support of the congress. I would also like to acknowledge other colleagues who enthusiastically contributed to the success of the congress, and in fact to the publication of this special issue. The 3rd congress in the field will be run in 2016 but the conference place is currently under discussion and will be annouced soon through the websites of both the International Union of Advanced Materials (http://www.iuam.org) and the Chinese Advanced Materials Society (http://www.thecams.org). I look forward to welcoming all of you in the 3rd congress, again.